Method of performing a double-sided process
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United States of America Patent
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Jul 28, 2009
Grant Date -
Dec 27, 2007
app pub date -
Sep 6, 2007
filing date -
Nov 11, 2005
priority date (Note) -
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Abstract
A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.
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