Feature printability optimization by optical tool

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United States of America Patent

PATENT NO 7566517
SERIAL NO

11271207

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatus, including computer program products, implementing and using techniques for optimizing feature printability on a semiconductor wafer. A reticle with a quasi-periodic structure is provided. The quasi-periodic structure includes several elements that each contribute to the printed feature to be printed on the wafer. Each element exhibits a slight variation in a reticle feature characteristic compared to an adjacent other element in the quasi-periodic structure. The reticle with the quasi-periodic structure is used to print several printed features on the semiconductor wafer. Each printed feature corresponds to a specific element in the quasi-periodic structure. A metrology process is performed on the semiconductor wafer to generate a signature for each of the printed features. The signature is used to determine an optimum reticle feature characteristic that results in an optimum printed feature.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR TECHNOLOGIES CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adel, Michael E Zichron Ya'akov, IL 48 1374
Mack, Chris A Austin, US 15 502

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