Composite processing apparatus and method

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United States of America Patent

PATENT NO 7563356
APP PUB NO 20060175191A1
SERIAL NO

10549324

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits is disclosed. The composite processing apparatus includes: a substrate holder for holding a substrate; a processing table including a mechanical processing section for processing a surface of the substrate by a processing method involving a mechanical action; and an electrolytic processing section which is separate from the mechanical processing section. The electrolytic processing section includes a processing electrode with an ion exchanger, for processing the substrate by applying a voltage between the processing electrode and the substrate while keeping the ion exchanger (92) in contact with the substrate. The composite processing apparatus also includes a liquid supply section for supplying a liquid between the substrate and the processing electrode, and between the substrate and the mechanical processing section; and a drive section for moving the substrate and the processing table relative to each other.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510 ?1448510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nabeya, Osamu Tokyo , JP 116 2177
Noji, Ikutaro Tokyo , JP 23 146
Saito, Takayuki Fujisawa , JP 172 2014
Suzuki, Tsukuru Fujisawa , JP 27 228
Toma, Yasushi Fujisawa , JP 40 401

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