Sputtering device

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United States of America Patent

PATENT NO 7563349
APP PUB NO 20060081463A1
SERIAL NO

11248257

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sputtering device includes at least: a vacuum container defining a vacuum space; a substrate holder installed rotatably in the vacuum space; a substrate installed on the substrate holder; a target for forming thin film on the substrate; and a rotatable sputtering cathode in which the target is installed. The sputtering cathode is slanted relative to the substrate, and a center of the target is eccentric to a rotation axis of the sputtering cathode.

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Patent Owner(s)

Patent OwnerAddress
SHOWA SHINKU CO LTD3062-10 TANA SAGAMIHARA-SHI KANAGAWA 229-1124

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Nobuyuki Sagamihara , JP 316 4437

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