Wafer tilt detection apparatus and method
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United States of America Patent
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Jul 14, 2009
Grant Date -
Nov 22, 2007
app pub date -
May 16, 2007
filing date -
May 19, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An exemplary embodiment providing one or more improvements includes a wafer tilt detection apparatus for use with a wafer processing or manufacturing device that applies a process to the wafer and which utilizes an endpoint signal for determining control of the process applied to the wafer. The wafer tilt apparatus uses the endpoint signal in establishing when the wafer was in a tilted orientation during processing.
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