Method of acceptance for semiconductor devices
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United States of America Patent
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Jul 14, 2009
Grant Date -
Feb 12, 2009
app pub date -
Aug 10, 2007
filing date -
Aug 10, 2007
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Abstract
A method of accepting semiconductor chips is provided using on-chip parametric measurements. An on-chip parametric measurement structure is determined for each parameter in a set of parametric acceptance criteria. An on-chip parametric measurement macro is included in a design of each semiconductor chip for each identified on-chip parametric measurement structure. Each on-chip parametric measurement macro is tested to determine compliance of the semiconductor chip to the set of parametric acceptance criteria. Compliance to the set of parametric acceptance criteria is validated.
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