Process condition measuring device with shielding
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United States of America Patent
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Jul 7, 2009
Grant Date -
Nov 1, 2007
app pub date -
May 5, 2006
filing date -
May 1, 2006
priority date (Note) -
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Abstract
A process condition measuring device has electronic components sandwiched between two conductive substrate portions. The conductive substrate portions are joined by an electrically conductive pathway. Native oxide is removed from substrate portions and electrically conductive contact pads are formed that are then joined together with electrically conductive adhesive to form the electrically conductive pathway. Sensors may be located on the exterior of the process condition measuring device with conductive leads extending to shielded electronic components.
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