Semiconductor packaging method

United States of America Patent

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Jun 30, 2009
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Feb 26, 2009
app pub date
Aug 21, 2008
filing date
Aug 23, 2007

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or more at normal temperature after the die attaching.

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Patent Owner	Address
H&S HIGH TECH CORP	62-7 TECHNO 1-RO YUSEONG-GU DAEJEON 305-509

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Hyun, Soon-Young	Gyeonggi-do, KR	8	28
Kang, Byoung-Un	Seoul, KR	11	20
Kim, Jae-Hoon	Seoul, KR	202	1846
Kim, Ji-Eun	Gyeonggi-do, KR	176	2962
Kim, Ju-Hyuk	Seoul, KR	4	3
Lee, Jun-Woo	Gyeonggi-do, KR	90	906
Seo, Joon-Mo	Gyeonggi-do, KR	11	23

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Semiconductor packaging method

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United States of America Patent

12195991

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PATENT NO	7553701
APP PUB NO	20090053857A1
SERIAL NO	12195991
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 30, 2009	US,7553701,B2 US7553701B2	GRANTED PATENT AS SECOND PUBLICATION
February 26, 2009	US,20090053857,A1 US20090053857A1	FIRST PUBLISHED PATENT APPLICATION

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