Dual electrical lapping guides with common bonding pad

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United States of America Patent

PATENT NO 7551406
SERIAL NO

11414468

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Importance

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Abstract

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A recording head comprises a write element, including a coil and a dynamic fly-height heater, and two electrical lapping guides. The head also comprises a number of bonding pads including a DFH bonding pad and a shared bonding pad both electrically connected to the dynamic fly-height heater. Each lapping guide defines a circuit between the shared bonding pad and a dedicated bonding pad and each includes a resistive element. The resistive elements of the two lapping guides can be vertically aligned to be used to control a lapping tilt angle when a bar of unfinished heads is lapped. After lapping, a channel is defined into the transducer of the recording head. Forming the channel can remove at least a portion of each lapping guide in order to break the electrical circuit of that guide.

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Patent Owner(s)

Patent OwnerAddress
WESTERN DIGITAL TECHNOLOGIES INC5601 GREAT OAKS PARKWAY SAN JOSE CA 95119

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Luc Ving Fremont, US 7 485
Luo, Peng Fremont, US 37 909
Thomas, Mark D Hollister, US 16 1450
Zhang, Lei Larry San Jose, US 7 1006

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