Toughening of thermosets

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7550521
APP PUB NO 20050234143A1
SERIAL NO

10519251

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Abstract

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A method of manufacturing thermosets such as epoxy resins includes adding expandable hollow microspheres, which expand with temperature as shown in the accompanying graph, to the base thermoset components in the liquid phase and applying heat treatment to the mixture so formed causing the micropsheres to expand during or after curing of the thermoset. This results in a toughening mechanism caused by compressive residual stress around the microspheres which significantly increases the specific fracture energy of the epoxy resin.

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Patent Owner(s)

Patent OwnerAddress
THE UNIVERSITY OF NEWCASTLE RESEARCH ASSOCIATES LIMITEDINDUSTRY DEVELOPMENT CENTRE UNIVERSITY DRIVE CALLAGHAN NEW SOUTH WALES 2308

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Ho Sung New South Wales, AU 61 159
Kim, Nam Ho New South Wales, AU 50 205

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