Method for bonding substrates and device for bonding substrates
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United States of America Patent
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Jun 23, 2009
Grant Date -
Jun 7, 2007
app pub date -
Dec 2, 2005
filing date -
Dec 2, 2005
priority date (Note) -
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Abstract
A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.
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