Mounting method of electronic components
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United States of America Patent
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Jun 23, 2009
Grant Date -
Oct 19, 2006
app pub date -
Jun 14, 2006
filing date -
Nov 21, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
Methods of mounting electronic components on a plurality of printed circuit boards simultaneously are provided. An exemplary method may include supplying a first printed circuit board to a first conveyor and then transferring the first printed circuit board to a second conveyor and simultaneously supplying a second printed circuit board to the first conveyor. The method may then include transferring the first printed circuit board to a third conveyor and the second printed circuit board to a third conveyor, and mounting electronic components on about half of the first printed circuit board by moving the first printed circuit board to one side and, simultaneously mounting electronic components on about half of the second printed circuit board. The method may then include sequentially transferring the first and second printed circuit boards to a fourth conveyor, and then sequentially discharging the first and second printed circuit boards.
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