Methods for repairing circuit board having defective pre-soldering bump
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United States of America Patent
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Jun 16, 2009
Grant Date -
Dec 6, 2007
app pub date -
Nov 21, 2006
filing date -
Jun 6, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.
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