Photosensitive adhesive composition
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United States of America Patent
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Jun 9, 2009
Grant Date -
Aug 18, 2005
app pub date -
Apr 2, 2003
filing date -
Apr 3, 2002
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Abstract
A photosensitive adhesive composition of the polymerizable resin type, the hardening of which occurs by polymerization and/or reticulation, includes:—initiators for at least one chain polymerization reaction to guarantee the hardening of the composition and a sufficient quantity of at least one bifunctional monomer, including a photolabile center with at least one photolabile entity and at least two polymerizable units, connected by covalent skeletons to the photolabile center and located away from the cleavage sites of the photolabile center, such that the composition loses the integrity and adhesivity thereof under the influence of a reticulating radiation causing the cleavage of the photolabile sites. The composition is particularly of application in dentistry.
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