Burn-in sorter and sorting method using the same
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United States of America Patent
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Jun 2, 2009
Grant Date -
Dec 27, 2007
app pub date -
Jun 12, 2007
filing date -
Jun 13, 2006
priority date (Note) -
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Abstract
Provided is an apparatus for sorting burn-in tested packaged chips, including a DC test unit performing a DC test on packaged chips, a DC failure/loading head moving in a first direction to load packaged chips onto the DC test unit, and an inserting head moving in a second direction perpendicular to the first direction to transfer DC test-passed packaged chips from the DC test unit to a burn-in board, wherein the DC test unit is moved in the second direction, close to the DC failure/loading head when loading the packaged chips onto the DC test unit and close to the inserting head when transferring the packaged chips to the burn-in board, to sort burn-in tested packaged chips. The structure in which the DC test unit is movable toward the DC failure/loading head and the inserting head makes it possible to reduce the distance which the heads have to travel and to prevent the DC failure/loading head and the inserting head from interfering with each other.
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