Method and apparatus for thermally processing microelectronic workpieces
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 2, 2009
Grant Date -
Apr 19, 2007
app pub date -
Nov 10, 2006
filing date -
Nov 12, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for thermally processing a microelectronic workpiece comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The loading, heating and cooling stations are radially positioned about a center axis of the carousel assembly. The heating station includes a heating element and an actuator for moving the heating element into thermal engagement with the workpiece in the heating station. The cooling station includes a cooling element and an actuator for moving the cooling element into thermal engagement with the workpiece in the cooling station. A process fluid distribution manifold for delivering process fluid to the workpieces at each station extends through a central opening in the carousel assembly. A non-oxidizing gas is delivered through the manifold to create an oxygen free environment during the thermal process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully