Substrate processing apparatus and substrate processing method
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United States of America Patent
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Jun 2, 2009
Grant Date -
Feb 22, 2007
app pub date -
Aug 15, 2006
filing date -
Aug 19, 2005
priority date (Note) -
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Abstract
A substrate processing apparatus performs a chemical solution process in a chemical solution process room that is partially formed within a chamber. During the chemical solution process, the substrate processing apparatus seals the chemical solution process room, and measures the pressure within the chemical solution process room, and controls the pressure within the chemical solution process room, based on a measured value. Irrespective of location environment of the substrate processing apparatus, the chemical solution process room can be controlled to a predetermined pressure. The substrate processing apparatus also permits efficient pressure control with respect to a minimum required amount of region.
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