Combination assembly of LED and liquid-vapor thermally dissipating device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 26, 2009
Grant Date -
May 22, 2008
app pub date -
Feb 7, 2007
filing date -
Nov 22, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An LED and liquid-vapor heat-dissipating device assembly is composed of a liquid-vapor heat-dissipating device and at least one LED unit. The liquid-vapor heat-dissipating device includes a metal housing, a predetermined amount of liquid, and a capillary member. The LED unit includes an LED chip mounted to and electrically connected with the metal housing, an insulating board mounted to the surface of the metal housing, an electrode located on the insulating board, a wire having two ends connected with the LED chip and the electrode respectively, and a sealant fully encapsulating the wire and the LED chip and at least partially encapsulating the insulating board and the electrode. Accordingly, the heat generated by the LED chip can be directly conducted to the liquid-vapor heat-dissipating device and, such that the present invention has preferably thermally conductive/dissipating efficiency.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully