Printed wiring board and a method of manufacturing the same
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United States of America Patent
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May 19, 2009
Grant Date -
Jun 1, 2006
app pub date -
Dec 1, 2005
filing date -
Dec 1, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is formed on the insulating board in a process step. The resistor pattern includes the metallic material and is formed on the insulating board at a time together with the wiring pattern in the process step of the wiring pattern.
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