Lids for wafer-scale optoelectronic packages
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United States of America Patent
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May 19, 2009
Grant Date -
Dec 29, 2005
app pub date -
Mar 31, 2005
filing date -
Jun 24, 2004
priority date (Note) -
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Abstract
A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.
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