Method and apparatus for laser perforating printed circuit board

United States of America Patent

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May 12, 2009
Grant Date
Sep 21, 2006
app pub date
Mar 2, 2006
filing date
Mar 4, 2005

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Expired

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Abstract

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the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

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Patent Owner	Address
VIA MECHANICS LTD	9-32 TAMURACHO ATSUGI-SHI KANAGAWA-KEN 243-0016

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Inventor Name	Address	# of filed Patents	Total Citations
Arai, Kunio	Ebina, JP	51	678
Ashizawa, Hiroaki	Ebina , JP	31	332
Nishiyawa, Hiromi	Ebina, JP	2	14
Sugawara, Hiroyuki	Hitachinaka, JP	53	363

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Method and apparatus for laser perforating printed circuit board

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United States of America Patent

11365657

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PATENT NO	7531767
APP PUB NO	20060211158A1
SERIAL NO	11365657
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 12, 2009	US,7531767,B2 US7531767B2	GRANTED PATENT AS SECOND PUBLICATION
September 21, 2006	US,20060211158,A1 US20060211158A1	FIRST PUBLISHED PATENT APPLICATION

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11365657

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