Build-in-place method of manufacturing thermoelectric modules
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United States of America Patent
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May 12, 2009
Grant Date -
N/A
app pub date -
Oct 15, 2004
filing date -
Oct 15, 2004
priority date (Note) -
Expired
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Abstract
A method of manufacturing a thermoelectric module is provided. The method includes mounting a thermoelectric material to a substrate such that a portion of the thermoelectric material covers a removable pattern. The thermoelectric material is then segmented and the removable pattern is removed. The portions of the thermoelectric material which were covering the removable pattern are also removed, leaving the portions of the thermoelectric material not covering the removable pattern attached to the substrate.
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