Method of fabricating suspended structure
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United States of America Patent
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May 12, 2009
Grant Date -
Dec 20, 2007
app pub date -
Nov 21, 2006
filing date -
Jun 19, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.
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