Heat pump, heat pump system, method of pumping refrigerant, and rankine cycle system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7530235
APP PUB NO 20070199323A1
SERIAL NO

11686857

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Abstract

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A Rankine cycle system has a condenser, a heat pump connected to the condenser, a heat collecting device connected to the heat pump, and an expansion turbine connected to the heat collecting device and the condenser. The heat pump includes an expansion tank or closed vessel, a refrigerant supply conduit connected to the lower part of the expansion tank and to the condenser, and a refrigerant discharge conduit connected to the upper part of the expansion tank. An open/close valve is installed in the refrigerant supply conduit. A pressure regulating valve installed in the refrigerant discharge pipe opens when a pressure reaches a specified value or higher. A temperature regulating device can heat the refrigerant in the expansion tank to produce a refrigerant vapor of saturated temperature or higher, which vapor can be introduced into the heat collecting device.

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Patent Owner(s)

Patent OwnerAddress
SHOWA DENKO K K13-9 SHIBA DAIMON 1-CHOME MINATO-KU TOKYO 1058518 ?1058518
THE DOSHISHA601 GENBU-CHO KARASUMA-HIGASHI-IRU IMADEGAWA-DORI KAMIGYO-KU KYOTO-SHI KYOTO 617-8555
SHOWA DENKO GAS PRODUCTS CO LTD1310 OMIYACHO SAIWAI-KU KAWASAKI-SHI KANAGAWA 212-0014
YOSHIMURA CONSTRUCTION CO LTD1 OGURACHO NISHINOKYO NAKAGYO-KU KYOTO-SHI KYOTO 604-8414

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enomoto, Masatoshi Oyama, JP 25 228
Fujima, Katsumi Tsukuba , JP 7 49
Sawada, Noboru Tokyo , JP 3 33
Yamaguchi, Hiroshi Kyoto , JP 619 8013

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