Process for producing PTC element/metal lead element connecting structure and PTC element for use in the process

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United States of America Patent

PATENT NO 7528350
APP PUB NO 20060102692A1
SERIAL NO

10526705

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Abstract

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The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said connection structure having (A) a PTC device (10) including (i) a laminar polymer PTC element (12) and (ii) a metal foil electrode (14) disposed on a main surface of the laminar polymer PTC element (12), and (B) a metal lead element (20) electrically connected to the metal foil electrode. The metal foil electrode (14) has at least two metal layers, one of which, the X-th layer, has laser beam absorption a % that is the lowest among the metal layers of the metal foil electrode (14). The X-th layer is present between a first metal layer (18) of the metal foil electrode and the laminar polymer PTC element (12). First metal layer (18) is located farthest from the laminar polymer PTC element (12) and has a laser beam absorption of b %, where b>a.

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Patent Owner(s)

Patent OwnerAddress
LITTELFUSE JAPAN G KAKASAKA K TOWER 1-2-7 MOTOASAKA MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iimura, Mikio Inashiki , JP 3 4
Nakagawa, Atsushi Ibaraki, JP 120 3288
Tanaka, Arata Ryugasaki , JP 27 126

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