High performance system-on-chip using post passivation process
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United States of America
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Apr 28, 2009
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app pub date -
Oct 23, 2007
filing date -
Oct 23, 2007
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Abstract
The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.
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