Submount for light emitting diode and its manufacturing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7525124
APP PUB NO 20060054910A1
SERIAL NO

11221817

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Abstract

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A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.

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Patent Owner(s)

Patent OwnerAddress
TOYODA GOSEI CO LTDAICHI-PREF
HITACHI KYOWA ENGINEERING CO LTDIBARAKI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashiyama, Satoshi Hitachinaka, JP 7 49
Hirose, Minoru Haruhi, JP 42 1529
Kawaguchi, Hiroaki Haruhi, JP 19 168
Mori, Kenji Haruhi , JP 278 4504
Takemori, Hideaki Hitachinaka, JP 14 109
Tohmon, Ryoichi Haruhi , JP 9 661

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