Bonding method using capillary condensation effect
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United States of America Patent
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Apr 28, 2009
Grant Date -
May 6, 2004
app pub date -
Mar 20, 2003
filing date -
Apr 1, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
As an efficient and economical bonding method indispensable for the bonding between dimension-small constituent elements (members, parts) to manufacture a minute (micro) structure, a micromachine, etc. is provided a bonding method using a capillary condensation effect characterized in that in order to bond at least two separated bonding targets (works) at a prescribed joint point, the bonding targets are disposed under an atmosphere comprising a prescribed vapor pressure of adhesive agent, and the adhesive agent is subjected to capillary condensation at the joint point to thereby form uniform meniscus and bond the bonding targets (works) by the adhesive agent constituting the meniscus.
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