Power-enabled connector assembly with heat dissipation apparatus and method of manufacturing
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United States of America Patent
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Apr 28, 2009
Grant Date -
Jan 18, 2007
app pub date -
Mar 22, 2006
filing date -
Mar 23, 2005
priority date (Note) -
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Abstract
An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.
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