Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics

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United States of America Patent

PATENT NO 7523617
APP PUB NO 20060086118A1
SERIAL NO

10970378

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Abstract

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A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

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Patent Owner(s)

  • LAIRD TECHNOLOGIES, INC.;NEXTREME THERMAL SOLUTIONS, INC.;NEXTREME THERMAL SOLUTIONS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Addepalli, Pratima Cary , US 13 372
Alley, Randall G Raleigh , US 9 468
Colpitts, Thomas Durham , US 6 452
Coonley, Kip D Durham, US 4 251
O'Quinn, Brooks C Mamers, US 5 295
Posthill, John Chapel Hill , US 4 332
Reddy, Anil J Carrboro, US 17 267
Siivola, Edward P Raleigh, US 9 409
Venkatasubramanian, Rama Cary, US 51 1168

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