Apparatus and method for inspecting semiconductor wafer

United States of America Patent

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Apr 21, 2009
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Oct 4, 2007
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Jun 1, 2005
filing date
Jun 2, 2004

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exist within a prescribed range of mutual distances are inferred to be LADs.

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KOMATSU ELECTRONIC METALS CO LTD	KANAGAWA-KEN

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G01B:MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIME....

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Inventor Name	Address	# of filed Patents	Total Citations
Nabeshima, Fumi	Hiratsuka , JP	2	2
Togashi, Kazuya	Hiratsuka , JP	4	15

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Apparatus and method for inspecting semiconductor wafer

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United States of America Patent

11569249

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PATENT NO	7522290
APP PUB NO	20070229815A1
SERIAL NO	11569249
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 21, 2009	US,7522290,B2 US7522290B2	GRANTED PATENT AS SECOND PUBLICATION
October 04, 2007	US,20070229815,A1 US20070229815A1	FIRST PUBLISHED PATENT APPLICATION

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11569249

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