Probe needle protection method for high current probe testing of power devices
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United States of America Patent
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Apr 21, 2009
Grant Date -
Nov 27, 2008
app pub date -
May 23, 2007
filing date -
May 23, 2006
priority date (Note) -
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Abstract
A test system, apparatus and method for applying high current test stimuli to a semiconductor device in wafer or chip form includes a plurality of probes for electrically coupling to respective contact points on the semiconductor device, a plurality of current limiters electrically coupled to respective ones of the plurality of probes, and a current sensor electrically coupled to the plurality of probes. The current limiters are operative to limit current flow passing through a respective probe, and the current sensor is operative to provide a signal when detected current in any contact of the plurality of probes exceeds a threshold level.
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