Cresol-free or low-cresol wire enamels
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United States of America Patent
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Apr 21, 2009
Grant Date -
Feb 16, 2006
app pub date -
May 25, 2005
filing date -
Feb 19, 2002
priority date (Note) -
Expired
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Abstract
The invention relates to wire enamels based on polyester, polyesterimide, polyesteramidoimide and/or polyurethane resins, which contain one or more of said resins as binders, and organic solvents and optionally diluents. At least 50% by weight of the solvent or of the solvent/diluent mixture consists of a monocyclic aromatic alkyl-carboxylic acid ester or isophorone or of a mixture of methyl benzoate and isophorone.
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