Positive photosensitive resin, process for production thereof, and resist composition containing positive photosensitive resin
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United States of America Patent
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Apr 21, 2009
Grant Date -
Sep 14, 2006
app pub date -
Mar 7, 2006
filing date -
Mar 10, 2005
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Expired
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Abstract
The positive photosensitive resin of the present invention has an acid-labile protecting group and the structure represented by the following general formula (1):may be the same or different and are each independently a hydrogen atom, a straight or branched chain hydrocarbon group having 1 to 6 carbon atoms, a sulfur-containing hydrocarbon group, or an aromatic hydrocarbon group which may have a substituent; and two Zs may be the same or different and each independently an oxygen atom or a sulfur atom).
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