Housing with hidden ventilation holes
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United States of America Patent
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-
Apr 21, 2009
Grant Date -
Jan 24, 2008
app pub date -
Jul 24, 2006
filing date -
Jul 24, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is to provide a housing structure of an electronic device, which comprises a housing including a slot on a top surface; a plate member mounted in the slot and including a plurality of first ventilation holes formed along a periphery, the first ventilation holes being in communication with inside of the housing; and a cap mounted on the plate member and spaced from the top surface of the housing by a peripheral gap formed between the cap and the plate member; wherein the first ventilation holes are concealed by the cap. By utilizing the present invention, hot air inside the housing can be quickly removed via the first ventilation holes and the gap so as to achieve the purpose of heat dissipation, and the housing's appearance can be preserved since the first ventilation holes are concealed by the cap.
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