Optoelectronic component assembly
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United States of America Patent
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Apr 14, 2009
Grant Date -
May 12, 2005
app pub date -
Oct 12, 2004
filing date -
Nov 8, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Optoelectronic component assemblies include a carrier element having a recess, the recess having at least one stepped supporting surface in the region of its periphery at a defined height between the bottom of the recess and the top edge of the recess. Arranged above the optoelectronic component in the region of the recess is a transparent cover element which has a structuring in at least one partial area. The cover element rests in the region of the supporting surface and is secured in this region by a bonding material. The upper side of the cover element may project above the top edge of the recess. Different materials may be provided as an encapsulation material and a bonding material.
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