Encapsulation for organic device
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United States of America Patent
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Apr 14, 2009
Grant Date -
Dec 20, 2007
app pub date -
Jun 12, 2007
filing date -
Jun 13, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.
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