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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HITACHI KYOWA ENGINEERING CO LTD	IBARAKI

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fujinaga, Takeru	Hitachinaka, JP	6	44
Hata, Shohei	Yokohama , JP	31	300
Matsushima, Naoki	Yokohama, JP	46	386

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 31, 2009	US,7511232,B2   US7511232B2	GRANTED PATENT AS SECOND PUBLICATION
October 26, 2006	US,20060237231,A1   US20060237231A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7511232

Substrate for mounting electronic part and electronic part

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