Method for wafer level packaging and fabricating cap structures
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United States of America Patent
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Mar 31, 2009
Issued Date -
N/A
app pub date -
Jul 3, 2006
filing date -
Jan 12, 2006
priority date (Note) -
Expired
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Abstract
A cap wafer with patterned film formed thereon is etched through areas not covered by the patterned film to form a plurality of openings. Then, the cap wafer is bonded to a transparent wafer, and the cap wafer around the pattern film is segmented to form a plurality of cap structures. A device wafer with a plurality of devices and a plurality of contact pads electrically connected to the devices is subsequently provided. The cap structures and the device wafer are hermetically sealed to form a plurality of hermetic windows on the devices.
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