Photosensitive resin composition and method for the formation of a resin pattern using the composition
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United States of America Patent
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Mar 17, 2009
Grant Date -
Nov 11, 2004
app pub date -
Jan 30, 2004
filing date -
Jan 31, 2003
priority date (Note) -
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Abstract
A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. By using the method of this invention, it is possible to form a conductive film selectively on a resin pattern formed through exposure and development of the photosensitive resin composition of this invention.
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