Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder
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United States of America Patent
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Mar 17, 2009
Grant Date -
Mar 8, 2007
app pub date -
Aug 25, 2006
filing date -
Aug 25, 2005
priority date (Note) -
Expired
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Abstract
The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500° C., in particular, not less than 900° C. The raw material metal used as raw material of the solder powder comprises 3 to 12% by weight of Zn, 1.0 to 15% by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided.
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