Method and apparatus for detecting substrate temperature in a track lithography tool
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United States of America Patent
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Mar 10, 2009
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N/A
app pub date -
Oct 25, 2007
filing date -
Oct 25, 2007
priority date (Note) -
Expired
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Abstract
The temperature of a wafer is measured using thermal sensors that are embedded in elastomeric diaphragms positioned in holes formed in a support layer of a bake plate. A pressure differential caused by heating the bake plate causes the elastomeric diaphragms to contact the wafer. The thermal sensors determine the temperature of the wafer at the locations where the elastomeric diaphragms contact the wafer.
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