Optical inspection method for substrate defect detection
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United States of America Patent
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Mar 3, 2009
Grant Date -
Nov 4, 2004
app pub date -
May 24, 2004
filing date -
Nov 16, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.
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