Combined modulated optical reflectance and electrical system for ultra-shallow junctions applications
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United States of America Patent
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Mar 3, 2009
Grant Date -
Aug 16, 2007
app pub date -
Jan 23, 2007
filing date -
Feb 14, 2006
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Abstract
A metrology tool for semiconductor wafers is disclosed which combines modulated reflectivity measurement with junction photovoltage measurements. The tool includes an intensity modulated pump beam for periodically exciting the sample. A separate probe beam is used to monitor changes in optical reflectivity of the sample. In addition, capacitive electrodes are provided to measure modulated changes in the voltage across the electrodes. These measurements are combined to evaluate the wafer. These measurement can be particularly useful in characterizing ultrashallow junctions.
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