Method and system for detection of wafer centering in a track lithography tool

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7497026
APP PUB NO 20080168673A1
SERIAL NO

11763352

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Abstract

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A system for measuring substrate concentricity includes a substrate support member adapted to rotate a substrate around a substantially vertical axis. The substrate includes a mounting surface and a process surface. The system also includes a spin cup positioned below the substrate and a translatable arm mounted a predetermined distance above the process surface of the substrate. The translatable arm is adapted to translate along a radius of the substrate. The system further includes an optical emitter mounted on the translatable arm and an optical detector mounted on the translatable arm.

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Patent Owner(s)

Patent OwnerAddress
SOKUDO CO LTDKYOTO CITY KYOTO PREFECTURE JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Herchen, Harald Los Altos, US 109 3627
Pang, Lily Fremont, US 9 234
Porras, Erica Los Gatos, US 8 43

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