Probe card assembly with a dielectric strip structure coupled to a side of at least a portion of the probes
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United States of America Patent
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Feb 24, 2009
Grant Date -
Jan 31, 2008
app pub date -
Aug 10, 2007
filing date -
May 3, 2005
priority date (Note) -
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Abstract
A probe card assembly for providing electrical interconnection between a semiconductor device to be tested and a test system is provided. The probe card assembly includes a plurality of probes supported by a support substrate, each of the plurality of probes including an end portion extending away from the support substrate. The end portion is configured to be electrically connected to a semiconductor device to be tested. The probe card assembly also includes a dielectric sheet positioned between the support substrate and the end portion of the plurality of probes such that the probes extend through apertures defined by the dielectric sheet.
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