System and method for providing a power bus in a wirebond leadframe package
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United States of America Patent
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Feb 24, 2009
Grant Date -
Nov 1, 2007
app pub date -
Apr 27, 2006
filing date -
Apr 27, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An integrated circuit (IC) package, such as a Quad Flat Pack (QFP), has at least one lead with a tip that extends substantially perpendicular to the ends of two or more bondwires, so that there is room for more than one bondwire to be attached to it along its length. Thus, bondwires leading from die bondpads that are not adjacent to one another can be efficiently connected to the same lead in a bus-like manner.
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