Soldering method
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United States of America Patent
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Feb 17, 2009
Grant Date -
May 17, 2007
app pub date -
Dec 5, 2006
filing date -
Jan 11, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
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