Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
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United States of America Patent
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Feb 10, 2009
Grant Date -
Jun 30, 2005
app pub date -
Dec 20, 2004
filing date -
Dec 25, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes a base plate, and a semiconductor constituent body formed on the base plate. The semiconductor constituent body has a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base plate around the semiconductor constituent body. A hard sheet is formed on the insulating layer. An interconnection is connected to the external connecting electrodes of the semiconductor constituent body.
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