Impregnating reinforcing material with photopolymerizable epoxy resin composition
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United States of America Patent
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Feb 10, 2009
Grant Date -
Aug 9, 2007
app pub date -
Apr 5, 2007
filing date -
Jul 31, 2001
priority date (Note) -
Expired
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Abstract
Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70.degree. C. (measured by means of DSC at a heating rate of 10.degree. C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.
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